Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SMD-6
External dimensions/packaging: SMD-6
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
H11L2SM
|
ON Semiconductor | 功能相似 | PDIP-6 |
H11L2M: 6 引脚 DIP 施密特触发器输出光耦合器
|
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