Technical parameters/Contact electroplating: Gold
Technical parameters/number of plug and unplug cycles: 500
Encapsulation parameters/installation method: Solder
External dimensions/length: 14.8 mm
Physical parameters/contact material: Beryllium Copper
Physical parameters/insulation material: Teflon
Physical parameters/operating temperature: -55℃ ~ 85℃
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
|---|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review