Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
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Nexperia | 功能相似 |
74HCT 系列,NXP 高速 CMOS 逻辑 工作电压 4.5 - 5.5 兼容性:输入 TTL、输出 CMOS ### 74HCT 系列
|
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74HCT374N,652
|
NXP | 功能相似 | DIP-20 |
74HCT 系列,NXP 高速 CMOS 逻辑 工作电压 4.5 - 5.5 兼容性:输入 TTL、输出 CMOS ### 74HCT 系列
|
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CD74HCT374E
|
TI | 功能相似 | DIP-20 |
TEXAS INSTRUMENTS CD74HCT374E 触发器, D, 15 ns, 60 MHz, 6 mA, DIP, 20 引脚
|
||
SN74HCT374N
|
TI | 功能相似 | DIP-20 |
TEXAS INSTRUMENTS SN74HCT374N 触发器, 三态非反相, 正沿, D, 35 ns, 40 MHz, 6 mA, DIP, 20 引脚
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