Encapsulation parameters/installation method: Surface Mount
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Micrel | 完全替代 | MLF-4 |
超小型 单 150 mA LDO 采用1 mm x 1 mm TMLF封装
|
||
MIC5365-1.8YMT-TZ
|
Microchip | 完全替代 | TMLF-4 |
超小型 单 150 mA LDO 采用1 mm x 1 mm TMLF封装
|
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