Technical parameters/number of channels: 1
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 5
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/length: 2 mm
External dimensions/width: 1.25 mm
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MC74VHC1G66DTT1G
|
ON Semiconductor | 完全替代 | TSOT-23-5 |
ON SEMICONDUCTOR MC74VHC1G66DTT1G 芯片, 模拟开关, SPST
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review