Technical parameters/dissipated power: 330 mW
Technical parameters/common mode rejection ratio: 56.48 dB
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): -40 ℃
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: SOIC-8
External dimensions/length: 5 mm
External dimensions/width: 4 mm
External dimensions/height: 1.5 mm
External dimensions/packaging: SOIC-8
Physical parameters/operating temperature: -40℃ ~ 85℃
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MAX966ESA
|
Maxim Integrated | 完全替代 | SOIC-8 |
单/双/四路,微功耗,超低电压,轨至轨I / O比较 Single/Dual/Quad, Micropower, Ultra-Low-Voltage, Rail-to-Rail I/O Comparators
|
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