Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: SOIC
External dimensions/packaging: SOIC
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MAX9042BESA
|
Maxim Integrated | 功能相似 | SOIC-8 |
微功耗,单电源, SOT23比较器+精密电压基准IC Micropower, Single-Supply, SOT23 Comparator + Precision Reference ICs
|
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