Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: SOIC
External dimensions/packaging: SOIC
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MAX844ESA+T
|
Maxim Integrated | 功能相似 | SOIC-8 |
IC BIAS GAASFET REG 8-SOIC
|
||
MAX844ISA+T
|
Maxim Integrated | 功能相似 | SOIC-8 |
Charge Pump INV -2V/-0.5V to -9.4V 4mA 8Pin SOIC N T/R
|
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