Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 3
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MAX803SEXR+T10
|
Maxim Integrated | 功能相似 | SC-70-3 |
Processor Supervisor 2.93V 2.5V/3V/3.3V/5V 3Pin SC-70 T/R
|
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