Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Bulk
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MAX744ACPA+
|
Maxim Integrated | 功能相似 | PDIP-8 |
IC REG BUCK 5V 0.5A 8DIP
|
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