Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: DFN
External dimensions/packaging: DFN
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Maxim Integrated | 功能相似 | DFN |
Processor Supervisor Adj 6Pin UDFN
|
||
MAX6897PALT+T
|
Maxim Integrated | 功能相似 | WFDFN-6 |
MAXIM INTEGRATED PRODUCTS MAX6897PALT+T 芯片, 微处理器监控器, 5.5V, UDFN-6
|
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