Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: SOP
External dimensions/packaging: SOP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MAX632AESA+
|
Maxim Integrated | 功能相似 | SOIC-8 |
Conv DC-DC 2V to 16.5V Step Up Single-Out 2V to 16.5V/12V 0.05A 8Pin SOIC N
|
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