Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TDFN
External dimensions/packaging: TDFN
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MAX4636ETB+T
|
Maxim Integrated | 功能相似 | TDFN-10 |
SPDT, 2 Func, 1Channel, CMOS, 3 X 3MM, 0.8MM HEIGHT, TQFN-10
|
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