Technical parameters/dissipated power: 457 mW
Technical parameters/dissipated power (Max): 457 mW
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 16
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
Physical parameters/operating temperature: -40℃ ~ 85℃
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tube, Rail
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
DG509ACJ+
|
Maxim Integrated | 功能相似 | DIP-16 |
MAXIM INTEGRATED PRODUCTS DG509ACJ+ 芯片, 模拟多路复用器, 双路, 4:1, DIP-16
|
||
MAX327ESE+
|
Maxim Integrated | 类似代替 | SOIC-16 |
MAXIM INTEGRATED PRODUCTS MAX327ESE+ 模拟开关, 超低漏电, SPST, 4 放大器, 3.5 kohm, 10V至30V, ± 5V至± 18V, NSOIC, 16 引脚
|
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