Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 16
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MAX4619CUE+
|
Maxim Integrated | 功能相似 | TSSOP-16 |
MAXIM INTEGRATED PRODUCTS MAX4619CUE+ 模拟开关, CMOS, SPDT, 3 放大器, 10 ohm, 2V 至 5.5V, TSSOP, 16 引脚
|
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