Technical parameters/peak pulse power: 30000 W
Technical parameters/minimum reverse breakdown voltage: 15.6 V
Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SMD
External dimensions/packaging: SMD
Physical parameters/operating temperature: -55℃ ~ 150℃ (TJ)
Other/Product Lifecycle: Active
Other/Manufacturing Applications: General
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MPLAD30KP14A
|
Microsemi | 完全替代 | SMD |
14V 30000W
|
||
MPLAD30KP14AE3
|
Microchip | 完全替代 | Bulk |
14V 30000W
|
||
MPLAD30KP14AE3
|
Microsemi | 完全替代 | SMD |
14V 30000W
|
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