Technical parameters/kernel architecture: dsPIC
Technical parameters/internal nuclear architecture: dsPIC33
Package parameters/number of pins: 100
Encapsulation parameters/Encapsulation: Module
External dimensions/packaging: Module
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Bulk
Other/Manufacturing Applications: Consumer Electronics, Sensing & Instrumentation, Motor Drive & Control, Consumer Electronics, Automotive, Sensing and Instrumentation, Communications&Networking, Industrial, Audio, Building Automation, Audio, Motor Drive and Control, Industrial, Communication and Networking, Automotive, Building Automation
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Compliant with standards/REACH SVHC standards: No SVHC
Compliant with standard/REACH SVHC version: 2015/12/17
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