Technical parameters/kernel architecture: PIC
Technical parameters/internal nuclear architecture: PIC32
Encapsulation parameters/Encapsulation: Module
External dimensions/packaging: Module
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Bulk
Other/Manufacturing Applications: Communications & Networking, Communication and Network
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Compliant with standards/REACH SVHC standards: No SVHC
Compliant with standard/REACH SVHC version: 2015/12/17
Customs information/ECCN code: 3A991.A.2
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
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