Technical parameters/kernel architecture: PIC
Encapsulation parameters/Encapsulation: Module
External dimensions/packaging: Module
Other/Product Lifecycle: Unknown
Other/Manufacturing Applications: Embedded Design&Development
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Compliant with standard/REACH SVHC version: 2016/06/20
Customs information/ECCN code: 3A991
Customs information/HTS code: 8473309100
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
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