Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: BQFP-160
External dimensions/packaging: BQFP-160
Physical parameters/operating temperature: 0℃ ~ 70℃ (TA)
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
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Lattice Semiconductor | 功能相似 | PQFP-160 |
CPLD - 复杂可编程逻辑器件 PROGRAM HI DENSITY CPLD
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