Encapsulation parameters/installation method: Through Hole
Physical parameters/medium materials: Tantalum
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
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VISHAY | 功能相似 |
Cap Tant Wet 60uF 50V 20% (10.31 X 19.46mm) Axial 2.65Ω 125℃
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Vishay Semiconductor | 功能相似 | Through Hole |
Cap Tant Wet 60uF 50V 20% (10.31 X 19.46mm) Axial 2.65Ω 125℃
|
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Vishay Sprague | 功能相似 |
Cap Tant Wet 60uF 50V 20% (10.31 X 19.46mm) Axial 2.65Ω 125℃
|
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|
Vishay Sprague | 完全替代 | Axial |
Cap Tant Wet 60uF 50V 20% (10.31 X 21.03mm) Axial (0.1%FR) 125℃
|
||
M39006/22-0353
|
VISHAY | 完全替代 | Axial |
Cap Tant Wet 60uF 50V 20% (10.31 X 21.03mm) Axial (0.1%FR) 125℃
|
||
|
|
Vishay Sprague | 完全替代 | Axial |
Cap Tant Wet 60uF 50V 20% (10.31 X 21.03mm) Axial (0.01%FR)
|
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