Encapsulation parameters/Encapsulation: BGA-484
External dimensions/packaging: BGA-484
Physical parameters/operating temperature: -40℃ ~ 100℃ (TJ)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
M2S090TS-FG484I
|
Microchip | 完全替代 | FPBGA-484 |
ARM Cortex-M3 166MHz 闪存:512KB RAM:64KB
|
||
|
|
SOC | 完全替代 | BGA-484 |
ARM Cortex-M3 166MHz 闪存:512KB RAM:64KB
|
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