Encapsulation parameters/Encapsulation: BGA-484
External dimensions/packaging: BGA-484
Physical parameters/operating temperature: 0℃ ~ 85℃ (TJ)
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
M2S010-FG484
|
Microsemi | 完全替代 | BGA-484 |
ARM Cortex-M3 166MHz 闪存:256KB RAM:64KB
|
||
M2S010-FG484
|
SOC | 完全替代 | BGA-484 |
ARM Cortex-M3 166MHz 闪存:256KB RAM:64KB
|
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