Technical parameters/number of contacts: 12
Technical parameters/polarity: Male
Technical parameters/Contact electroplating: Tin
Technical parameters/rated voltage (AC): 750 V
Technical parameters/rated current: 3 A
Technical parameters/insulation resistance: 10.0 GΩ
Technical parameters/number of rows: 2
Technical parameters/number of pins: 12
Technical parameters/Contact resistance: 20.0 mΩ
Technical parameters/number of plug and unplug cycles: 50
Technical parameters/rated current (Max): 3 A
Technical parameters/Contact resistance (Max): 30 mΩ
Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: -
Packaging parameters/pin spacing: 2.54 mm
External dimensions/height: 8.64 mm
External dimensions/packaging: -
External dimensions/pin spacing: 2.54 mm
Physical parameters/shell color: Black
Physical parameters/contact material: Phosphor Bronze
Other/Product Lifecycle: Active
Other/Packaging Methods: Bag
Other/Manufacturing Applications: -
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Compliant with standards/REACH SVHC standards: No SVHC
Compliant with standard/REACH SVHC version: 2015/12/17
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
67997-112HLF
|
FCI Electronics | 类似代替 |
AMPHENOL FCI 67997-112HLF Board-To-Board Connector, 2.54mm, 12Contacts, Header, BergStik 67997 Series, Through Hole, 2Rows
|
|||
67997-112HLF
|
Amphenol ICC | 类似代替 |
AMPHENOL FCI 67997-112HLF Board-To-Board Connector, 2.54mm, 12Contacts, Header, BergStik 67997 Series, Through Hole, 2Rows
|
|||
826942-6
|
TE Connectivity | 功能相似 | - |
AMP FROM TE CONNECTIVITY 826942-6 线至板连接器, 直型, AMPMODU Mod II系列, 12 触点, 针座, 2.54 mm, 通孔安装, 2 排
|
||
90131-0126
|
Molex | 功能相似 |
MOLEX 90131-0126 板至板连接, C-Grid III 90131系列, 12 触点, 针座, 2.54 mm, 通孔安装, 2 排
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review