Technical parameters/power supply voltage: 1.425V ~ 1.575V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 896
Encapsulation parameters/Encapsulation: FBGA-896
External dimensions/packaging: FBGA-896
Physical parameters/operating temperature: -55℃ ~ 125℃
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Actel | 完全替代 | BGA |
FPGA ProASIC®3EL Family 3M Gates 130nm Technology 1.2V/1.5V 896Pin FBGA
|
||
|
|
Microchip | 完全替代 | FBGA |
FPGA ProASIC®3EL Family 3M Gates 130nm (CMOS) Technology 1.2V/1.5V 896Pin FBGA
|
||
A3PE3000L-FG896M
|
Actel | 完全替代 | BGA |
FPGA ProASIC®3EL Family 3M Gates 130nm (CMOS) Technology 1.2V/1.5V 896Pin FBGA
|
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