Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 36
Encapsulation parameters/Encapsulation: SSOP
External dimensions/packaging: SSOP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LTC1439IGW#PBF
|
Linear Technology | 功能相似 | SSOP-36 |
降压型 3.5V~30V 400kHz
|
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