Chip AI consultant
Package parameters/number of pins: 16
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
Other/EU RoHS: Compliant
Other/ECCN (US): EAR99
Other/Part Status: Unconfirmed
Other/Supplier Package: TSSOP EP
Other/Pin Count: 16
Other/Counting: Surface Mount
Other/Package Height: 1.05(Max)
Other/Package Length: 6.6(Max)
Other/Package Width: 4.5(Max)
Other/PCB changed: 16
Compliant with standards/RoHS standards: RoHS Compliant
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