Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: DFN
External dimensions/packaging: DFN
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LT1763MPDE-3.3#TRPBF
|
ADI | 功能相似 | DFN |
IC REG LDO 3.3V 0.5A 12DFN
|
||
LT1763MPDE-3.3#TRPBF
|
Linear Technology | 功能相似 | DFN-12 |
IC REG LDO 3.3V 0.5A 12DFN
|
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