Technical parameters/output current: 25 mA
Technical parameters/dissipated power: 200 mW
Technical parameters/rise time: 90 ns
Technical parameters/descent time: 40 ns
Technical parameters/operating temperature (Max): 125 ℃
Technical parameters/operating temperature (Min): -55 ℃
Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: Flat-Pack
External dimensions/length: 11.13 mm
External dimensions/width: 7.24 mm
External dimensions/height: 2.85 mm
External dimensions/packaging: Flat-Pack
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
HCPL-665K
|
Broadcom | 功能相似 | Flatpack-16 |
Hermetically Sealed, High Speed, High CMR, Logic Gate Optocouplers
|
||
HCPL-665K
|
AVAGO Technologies | 功能相似 | Flat-Pack |
Hermetically Sealed, High Speed, High CMR, Logic Gate Optocouplers
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review