Encapsulation parameters/Encapsulation: LBGA-256
External dimensions/packaging: LBGA-256
Physical parameters/operating temperature: -40℃ ~ 100℃ (TJ)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
M2S025TS-1VF256I
|
Microsemi | 类似代替 | LFBGA-256 |
ARM Cortex-M3 166MHz 闪存:256KB RAM:64KB
|
||
M2S025TS-1VF256I
|
SOC | 类似代替 | VFBGA-256 |
ARM Cortex-M3 166MHz 闪存:256KB RAM:64KB
|
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