Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: Metal
External dimensions/packaging: Metal
Physical parameters/medium materials: Tantalum
Other/Product Lifecycle: Not Recommended for New Design
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
M39003/09-3064
|
KEMET Corporation | 功能相似 | Metal |
47uF ±10% 35V Φ8.92mm 19.96mm
|
||
|
|
Vishay Sprague | 功能相似 | Axial |
47uF ±10% 35V Φ8.92mm 19.96mm
|
||
M39003/09-4064
|
Vishay Sprague | 功能相似 | Axial |
47uF ±10% 35V Φ8.92mm 19.96mm
|
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