Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: BFBGA-561
External dimensions/packaging: BFBGA-561
Physical parameters/operating temperature: -40℃ ~ 100℃
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual |
|---|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review