Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: CDIP
External dimensions/packaging: CDIP
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MAX170CCPA+
|
Maxim Integrated | 功能相似 | DIP-8 |
MAXIM INTEGRATED PRODUCTS MAX170CCPA+ 模数转换器, 高速, 12 bit, 125 kSPS, 双 (+/-), 4.75 V, 5.25 V, DIP
|
||
MAX170DEPA+
|
Maxim Integrated | 功能相似 | DIP-8 |
ADC, Successive Approximation, 12Bit, 1 Func, 1Channel, Serial Access, CMOS, PDIP8, ROHS COMPLIANT, PLASTIC, DIP-8
|
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