Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: SOP
External dimensions/packaging: SOP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MAX3071EASA
|
Maxim Integrated | 功能相似 | SOIC-8 |
\+ 3.3V , ± 15kV ESD保护,失效保护,热插拔, RS - 485 / RS -422收发器 +3.3V, 【15kV ESD-Protected, Fail-Safe, Hot-Swap, RS-485/RS-422 Transceivers
|
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