Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TFSOP-10
External dimensions/packaging: TFSOP-10
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tube
Other/Manufacturing Applications: Fiber optic network
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MAX3269CUB+
|
Maxim Integrated | 功能相似 | TFSOP-10 |
IC AMP LIMITING 1.25Gbps 10UMAX
|
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