Technical parameters/number of circuits: 1
Technical parameters/dissipated power (Max): 1000 mW
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 28
Encapsulation parameters/Encapsulation: SOIC-28
External dimensions/packaging: SOIC-28
Physical parameters/operating temperature: 0℃ ~ 70℃ (TA)
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MAX307CWI+
|
Maxim Integrated | 类似代替 | SOIC-28 |
MAXIM INTEGRATED PRODUCTS MAX307CWI+ 芯片, 模拟多路复用器, 双路, 8:1, WSOIC-28
|
||
MAX307CWI+
|
Dallas Semiconductor | 类似代替 |
MAXIM INTEGRATED PRODUCTS MAX307CWI+ 芯片, 模拟多路复用器, 双路, 8:1, WSOIC-28
|
|||
MAX336EWI+
|
Maxim Integrated | 完全替代 | SOIC-28 |
MAXIM INTEGRATED PRODUCTS MAX336EWI+ 芯片, 模拟多路复用器, 单路, 16:1, WSOIC-28
|
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