Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 28
Encapsulation parameters/Encapsulation: SOP
External dimensions/packaging: SOP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MAX396CWI+
|
Dallas Semiconductor | 功能相似 |
MAXIM INTEGRATED PRODUCTS MAX396CWI+ 芯片, 多路复用器, CMOS模拟, 低电压, WSOIC28
|
|||
MAX396CWI+
|
Maxim Integrated | 功能相似 | SOIC-28 |
MAXIM INTEGRATED PRODUCTS MAX396CWI+ 芯片, 多路复用器, CMOS模拟, 低电压, WSOIC28
|
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