Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: VFBGA
External dimensions/packaging: VFBGA
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MAX4722EBL+T
|
Maxim Integrated | 功能相似 | UCSP-9 |
Analog Switch Dual SPST 9Pin UCSP T/R
|
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