Technical parameters/RAM size: 1 KB
Technical parameters/Analog to Digital Conversion (ADC): 1
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 64
Encapsulation parameters/Encapsulation: LQFP-64
External dimensions/packaging: LQFP-64
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
F8-16
|
Triad Magnetics | 功能相似 | Panel, Chassis |
Microcontroller, CMOS
|
||
|
|
Spansion | 功能相似 |
Microcontroller, CMOS
|
|||
F8-16
|
Triad Magnetics | 功能相似 |
Microcontroller, CMOS
|
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