Technical parameters/halogen-free state: Halogen Free
Technical parameters/dissipated power: 19000 mW
Technical parameters/operating temperature (Max): 105 ℃
Technical parameters/operating temperature (Min): -40 ℃
Technical parameters/dissipated power (Max): 19000 mW
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 1023
Encapsulation parameters/Encapsulation: BCBGA-994
External dimensions/height: 2.22 mm
External dimensions/packaging: BCBGA-994
Physical parameters/operating temperature: -40℃ ~ 105℃ (TA)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Freescale | 功能相似 | BCBGA-994 |
32Bit Power Architecture SoC, 1250MHz, DDR1/2, AltiVec, GbE, PCI-e, SRIO, -40 to 105C
|
||
MC8640TVJ1250HE
|
Freescale | 功能相似 | BCBGA-994 |
32Bit Power Architecture SoC, 1250MHz, DDR1/2, AltiVec, GbE, PCI-e, SRIO, -40 to 105C
|
||
MC8640TVJ1250HE
|
NXP | 功能相似 | FCCBGA-994 |
32Bit Power Architecture SoC, 1250MHz, DDR1/2, AltiVec, GbE, PCI-e, SRIO, -40 to 105C
|
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