Technical parameters/halogen-free state: Halogen Free
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 529
Encapsulation parameters/Encapsulation: BGA-529
External dimensions/packaging: BGA-529
Physical parameters/operating temperature: -40℃ ~ 95℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MCIMX515CJM6C
|
NXP | 完全替代 | BGA-529 |
NXP MCIMX515CJM6C 芯片, 微处理器, 32位, 600MHZ, MAPBGA-529
|
||
MCIMX515CJM6C
|
NXP | 完全替代 | BGA-529 |
NXP MCIMX515CJM6C 芯片, 微处理器, 32位, 600MHZ, MAPBGA-529
|
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