Technical parameters/operating temperature (Max): 100 ℃
Technical parameters/operating temperature (Min): -40 ℃
Technical parameters/power supply voltage: 1.14V ~ 1.26V
Technical parameters/power supply voltage (Max): 1.26 V
Technical parameters/power supply voltage (Min): 1.14 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 900
Encapsulation parameters/Encapsulation: FPBGA-900
External dimensions/length: 31 mm
External dimensions/width: 31 mm
External dimensions/height: 1.65 mm
External dimensions/packaging: FPBGA-900
Physical parameters/operating temperature: -40℃ ~ 100℃ (TJ)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LFE2M100E-5FN900I
|
Lattice Semiconductor | 完全替代 | FPBGA-900 |
95K LUTs 416 I/O SERDES Memory DSP 1.2V -5 Speed IND
|
||
LFE2M100E-6FN900I
|
Lattice Semiconductor | 完全替代 | FPBGA-900 |
FPGA LatticeECP2M Family 95000 Cells 90nm Technology 1.2V 900Pin FBGA
|
||
LFE2M100SE-5FN900I
|
Lattice Semiconductor | 完全替代 | FPBGA-900 |
FPGA - 现场可编程门阵列 95K LUTs 416 S Ser Memory DSP 1.2V 5SPD
|
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