Technical parameters/digits: 8
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 20
Encapsulation parameters/Encapsulation: SOP
External dimensions/length: 12.8015 mm
External dimensions/width: 7.5 mm
External dimensions/packaging: SOP
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MM74HCT245WMX
|
Rochester | 类似代替 | SOP |
ON Semiconductor MM74HCT245WMX 8位 非反相 总线收发器, 20引脚 SOIC封装
|
||
MM74HCT245WMX
|
Fairchild | 类似代替 | SOIC-20 |
ON Semiconductor MM74HCT245WMX 8位 非反相 总线收发器, 20引脚 SOIC封装
|
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