Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: MicroSMD-9
External dimensions/packaging: MicroSMD-9
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: PB free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LM4673TM
|
National Semiconductor | 完全替代 | BGA-9 |
音频功率放大器 LM4673TM uSMD-9(1.4x1.4)
|
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