Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: uSMD
External dimensions/packaging: uSMD
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: PB free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
TI | 功能相似 | FBGA |
CMOS计时器 CMOS Timer
|
||
LMC555CTP/NOPB
|
TI | 类似代替 | UFBGA-8 |
TEXAS INSTRUMENTS LMC555CTP/NOPB 芯片, 定时器, 单路, 3MHZ, 15V, DSBGA-8
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