Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SOIC
External dimensions/packaging: SOIC
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: PB free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
National Semiconductor | 功能相似 | 12V |
TEXAS INSTRUMENTS LMH6570MA 芯片, 高速多路复用器 2:1
|
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LMH6570MA
|
TI | 功能相似 | SOIC-8 |
TEXAS INSTRUMENTS LMH6570MA 芯片, 高速多路复用器 2:1
|
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