Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: LSSOP
External dimensions/packaging: LSSOP
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards:
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LP2981IM5-3.6/NOPB
|
National Semiconductor | 类似代替 | SOT-23 |
具有使能功能的 100mA、16V、低压降稳压器 5-SOT-23 -40 to 125
|
||
LP2981IM5-3.6/NOPB
|
TI | 类似代替 | SOT-23-5 |
具有使能功能的 100mA、16V、低压降稳压器 5-SOT-23 -40 to 125
|
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