Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: DSBGA-5
External dimensions/packaging: DSBGA-5
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
LP2985AITP-3.0/NOPB
|
TI | 类似代替 | UFBGA-5 |
微150毫安低噪音超低压降稳压器,采用SOT -23和DSBGA设计用于非常低ESR输出电容器的软件包 Micropower 150 mA Low-Noise Ultra Low-Dropout Regulator in SOT-23 and DSBGA Packages Designed for Use with Very Low ESR Output Capacitors
|
||
LP2985AITP-3.0/NOPB
|
National Semiconductor | 类似代替 | MicroSMD-5 |
微150毫安低噪音超低压降稳压器,采用SOT -23和DSBGA设计用于非常低ESR输出电容器的软件包 Micropower 150 mA Low-Noise Ultra Low-Dropout Regulator in SOT-23 and DSBGA Packages Designed for Use with Very Low ESR Output Capacitors
|
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