Technical parameters/halogen-free state: Halogen Free
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 783
Encapsulation parameters/Encapsulation: BBGA-783
External dimensions/packaging: BBGA-783
Physical parameters/operating temperature: -40℃ ~ 105℃ (TA)
Other/Product Lifecycle: Not Recommended for New Designs
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
MPC8541CVTAJD
|
Freescale | 完全替代 | PBGA-783 |
MPU PowerQUICC III MPC85xx Processor RISC 32Bit 533MHz 2.5V/3.3V 783Pin FCBGA Tray
|
||
|
|
Motorola | 完全替代 | 783 |
NXP MPC8541ECVTAJD Microprocessor, PowerQUICC III Series, 533MHz, 32Bit, 64KB, 1.14V to 1.26V, BGA-783
|
||
MPC8541ECVTAJD
|
Freescale | 完全替代 | FCPBGA-783 |
NXP MPC8541ECVTAJD Microprocessor, PowerQUICC III Series, 533MHz, 32Bit, 64KB, 1.14V to 1.26V, BGA-783
|
||
|
|
Motorola | 类似代替 | 783 |
微处理器 - MPU PQ 37 LITE 8555
|
||
MPC8541VTAJD
|
NXP | 类似代替 | FCBGA-783 |
微处理器 - MPU PQ 37 LITE 8555
|
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