Technical parameters/power supply voltage (DC): 15.0 V
Technical parameters/digits: 6
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 16
Encapsulation parameters/Encapsulation: SOIC
External dimensions/packaging: SOIC
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Cut Tape (CT)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Philips | 完全替代 | SOP |
Buffers & Line Drivers BUFFER HEX INVERTING
|
||
|
|
NXP | 完全替代 | SOIC |
Buffers & Line Drivers BUFFER HEX INVERTING
|
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